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MULTITEL - Laser Diode Dicing

This application has been made under free feasibility studies offered by the ECO-LASERFACT project.The main objective was to study the feasibility to dice laser diode bars with laser technology.The wafer substrate material is GaAs with a thickness about 100 µm and the dicing stripe area between devices is close to 40 µm.Laser bars have been cut using a femtosecond laser, with a very good quality cutting, reducing the impact on the semiconductor efficiency compared to classical mechanical cutting.